Box PC with 8th Gen Intel® Core™ U i7/i5/i3 CPU (TDP 15W)

DI-1100 Modular Embedded Computer-1
ART.NR DI-1100

Compact, High Performance, Modular Embedded Computer with 8th Gen Intel® Core™ U CPU (Whiskey Lake)

The DI-1100 packs high performance, lots of I/O ports, and expansion flexibility in a compact form factor. The DI-1100 is powered by an 8th Gen Intel® Core™ U-Series processor (Whiskey Lake) with ultra-low 15W TDP yet delivering uncompromised performance. The DI-1100 shines because it fits multiple I/Os and other expansion options into a very compact chassis, making it the perfect high-performance rugged embedded computer for space-constrained environments. The DI-1100 is ideal for industrial applications, logistics and warehousing, transportation, security and surveillance, IoT deployments, and other applications.

High Performance and Power Saving
The DI-1100 has options for an 8th Gen Intel® Core™ U i7, i5, or i3 processor, powered by four cores and eight threads, delivering extraordinary performance and responsiveness to complete computationally intensive tasks more quickly. The processing architecture fulfills the need for increased graphics and computation performance while providing the headroom to consolidate data and applications for IoT deployment. Topped off with a 15W CPU, it's ideal for mobile machinery reducing the time between recharges for maximum efficiency.

Compact Form Factor
The DI-1100 has a small form factor, measuring only 203 mm (W) x 142 mm (D) x 66.8 mm (H). This compact size makes the DI-1100 easy to install anywhere you can imagine, especially in today's space-limited IoT applications, ranging from equipment such as Automated Guided Vehicles (AGVs) and Autonomous Mobile Robots (AMRs) to vehicles and the small cabinets in factories.

Various Industrial I/O and Functionalities
The DI-1100’s compact design doesn’t sacrifice I/O and functionality. The DI-1100 includes 2x GbE LAN, 4x USB 3.2, 2x USB 2.0, and 2x RS232/422/485 to connect high-speed and legacy devices. The DI-1100 also supports 2x full-size Mini PCIe sockets for wireless connectivity as well as 2x SIM card slots for cellular network redundancy to ensure uninterrupted data transmission. In addition, it offers an external fan for additional cooling when using high-watt peripherals like cameras thru PoE.

Exclusive Expansion Capabilities
The DI-1100 provides modular expansion through Combined Multiple I/O (CMI) and Control Function Module (CFM) and can be configured for further I/O and function customization. This flexibility allows integrators to quickly configure the system and rapidly deploy to the market. The CMI modules include extra LAN, 10GbLAN, M12 connections (A- and X-coded), and various I/O interfaces, while CFM provides power ignition sensing or PoE functionality.

Robust Design with Industry Certifications
The DI-1100 is engineered with a robust design to withstand extreme environments. It features a wide operating temperature range of -40 to 70°C, wide-range voltage input of 9 to 48 VDC, over-voltage protection, over-current protection, and ESD protection. The DI-1100 passed the tests to ensure compliance with MIL-STD-810G, E-mark, and EN50155 (EN 50121-3-2 only).


  • Embedded 8th Gen Intel® Core™ U i7/i5/i3 CPU (TDP 15W)
  • 1x 2.5" front-accessible SATA HDD bay for quick access and 1x mSATA socket
  • 2x full-size Mini PCIe sockets for module expansion
  • 2x front-accessible SIM card slots for signal redundancy
  • Optional CMI modules (2x 10 GbE LAN, M12 A-coded, or M12 X-coded)
  • Optional CFM modules (power ignition sensing, or 4x PoE)
  • Wide operating temperature -40°C to 70°C
  • MIL-STD-810G, E-mark, and EN50155 (EN 50121-3-2 only) certified

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